Dicing Wafers with DISCO Saws and Dicing Blades
Dicing bumped wafers or dicing sapphire substrates, Disco dicing saws and dicing blades deliver excellent results. With facilities on the East and West coasts, difficult dicing requirements for all materials can be processed with extremely short lead-times.
Information on dicing various materials:
Other services include:
- Wafer and substrate edge grinding, rounding, chamfering, blending and polishing.
- V-grooves, laser slag removal, pyramids, slots and steps.